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portada Recent Technological Advances in Financial Market Infrastructure in Asean+3: Cross-Border Settlement Infrastructure Forum
Formato
Libro Físico
Idioma
Inglés
N° páginas
104
Encuadernación
Tapa Blanda
Dimensiones
27.9 x 21.6 x 0.7 cm
Peso
0.34 kg.
ISBN13
9789292695736

Recent Technological Advances in Financial Market Infrastructure in Asean+3: Cross-Border Settlement Infrastructure Forum

Asian Development Bank (Autor) · Asian Development Bank · Tapa Blanda

Recent Technological Advances in Financial Market Infrastructure in Asean+3: Cross-Border Settlement Infrastructure Forum - Asian Development Bank

Sin Stock

Reseña del libro "Recent Technological Advances in Financial Market Infrastructure in Asean+3: Cross-Border Settlement Infrastructure Forum"

This report identifies and examines six key technologies that are transforming fundamental financial market infrastructure and will serve as a springboard for the technological advancement of financial market infrastructure in the region. This report ascertains the most current status of technology adoption by Cross-Border Settlement Infrastructure Forum member organizations. They include central securities depositories and central banks in the Association of Southeast Asian Nations (ASEAN) plus the People's Republic of China, Japan, and the Republic of Korea (collectively known as ASEAN+3) region.

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