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Handbook of 3d Integration, Volume 4: Design, Test, and Thermal Management (en Inglés)
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Origen: España
(Costos de importación incluídos en el precio)
Se enviará desde nuestra bodega entre el
Martes 11 de Junio y el
Viernes 21 de Junio.
Lo recibirás en cualquier lugar de Internacional entre 1 y 3 días hábiles luego del envío.
Reseña del libro "Handbook of 3d Integration, Volume 4: Design, Test, and Thermal Management (en Inglés)"
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
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