Libro wafer bonding: applications and technology De Alexe, Marin ; Gösele, Ulrich

portada wafer bonding: applications and technology

Formato

Libro Físico

Ilustrado por

Marin Alexe

Ulrich Gösele

Editorial

Springer

Autor

Alexe, Marin ; Gösele, Ulrich

Año

2013

Idioma

Inglés

N° páginas

504

Encuadernación

Tapa Blanda

Dimensiones

23.4 x 15.6 x 2.7 cm

Peso

0.73 kg.

ISBN

3642059155

ISBN13

9783642059155

Categorías

Fïsica de la materia condensada
Ingeniería eléctrica
Dispositivos y materiales electrónicos

wafer bonding: applications and technology

Marin Alexe (Ilustrado por) · Ulrich Gösele (Ilustrado por) · Springer · Tapa Blanda

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Reseña del libro "wafer bonding: applications and technology"

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.