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Rf and Microwave Microelectronics Packaging
Ken (Edt) Kuang (Autor)
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Springer
· Tapa Dura
Rf and Microwave Microelectronics Packaging - ken (edt) kuang
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Reseña del libro "Rf and Microwave Microelectronics Packaging"
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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